VANISHING PROGRAMMABLE RESOURCES (VAPR) PHASE 1 - THE TECHNICAL OBJECTIVE OF THIS PROJECT IS TO UTILIZE THE PROPERTY OF STRAINED GLASS SUBSTRATES TO SHATTER (FRAGMENT) AS THE DRIVING FORCE TO REDUCE ATTACHED CMOS CHIPS INTO SI AND SIO2 POWDER. A TRIGGER, I.E., A FUSE OR A REACTIVE METAL LAYER, WILL BE USED TO INITIATE FRAGMENTATION, IN AT LEAST ONE LOCATION, ON THE GLASS SUBSTRATE. WE WILL ALSO DEVELOP METHODS TO ENHANCE GLASS FRAGMENTATION AND TECHNIQUES TO TRANSFER THIS INTO ATTACHED SI CMOS DEVICES.