Analyze awards, watch incumbents and competitors, track new transactions or changes, and use award history to shape recompete and capture strategy.
Award ID | Description | Recipient | Total Value | Awarding Agency | Funding Agency | Set Aside | NAICS | PSC | Award Date | Start Date | End Date | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| FAN OUT WAFER LEVEL PACKAGING | I3 MICROSYSTEMS, INC. | $3,861,534 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 541715Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) | AC62 | Sep 15, 2020 | Aug 12, 2022 | Jul 31, 2023 |