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Award ID | Description | Recipient | Total Value | Awarding Agency | Funding Agency | Set Aside | NAICS | PSC | Award Date | Start Date | End Date | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TRION PHANTOM III ETCH SYSTEM MAINTENANCE | TRION TECHNOLOGY INC | $29,543 | DEPT OF THE NAVY | WASHINGTON HEADQUARTERS SERVICES (WHS) | — | 811210Electronic and Precision Equipment Repair and Maintenance | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Jul 3, 2025 | Jul 3, 2025 | Apr 23, 2026 | ||
| PREVENTATIVE MAINTENANCE FOR PHANTOM II | TRION TECHNOLOGY INC | $77,500 | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | — | 334515Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Sep 7, 2023 | Sep 7, 2023 | Sep 17, 2028 | ||
| PREVENTATIVE MAINTENANCE FOR TRION ETCH SYSTEMS IN THE DDL | TRION TECHNOLOGY INC | $20,000 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 334516Analytical Laboratory Instrument Manufacturing | K099MODIFICATION OF EQUIPMENT- MISCELLANEOUS | Feb 24, 2022 | Feb 24, 2022 | Feb 24, 2024 | ||
| MAINTENANCE PARTS AND LABOR (PREVENTATIVE MAINTENANCE) | TRION TECHNOLOGY INC | $27,230 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 334516Analytical Laboratory Instrument Manufacturing | J099 | Sep 30, 2019 | Sep 30, 2019 | Sep 29, 2021 | ||
| PM FOR PHANTOM II AND PHANTOM II MINI-LOCK | TRION TECHNOLOGY INC | $159,817 | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | — | 334516Analytical Laboratory Instrument Manufacturing | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Aug 9, 2018 | Aug 9, 2018 | Sep 17, 2023 | ||
| TRION PHANTOM III REACTIVE ION ETCH SYSTEM FOR THE PROTECTION TECHNOLOGY LABORATORY. | TRION TECHNOLOGY INC | $345,100 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 333242Semiconductor Machinery Manufacturing | 3695MISCELLANEOUS SPECIAL INDUSTRY MACHINERY | Mar 13, 2018 | Mar 13, 2018 | Sep 10, 2018 | ||
| IGF::OT::IGF | TRION TECHNOLOGY INC | $61,110 | DEPT OF THE NAVY | DEPT OF THE NAVY | — | 334516Analytical Laboratory Instrument Manufacturing | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Aug 4, 2017 | Sep 18, 2017 | Sep 17, 2022 | ||
| UPGRADE TO TRION CHLORINE SYSTEM | TRION TECHNOLOGY INC | $15,526 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 334516Analytical Laboratory Instrument Manufacturing | 6695COMBINATION AND MISCELLANEOUS INSTRUMENTS | Sep 21, 2016 | Sep 21, 2016 | Dec 15, 2016 | ||
| SOFTWARE-WINDOWS 7 DISKS, ALONG WITH THE REQUIRED DRIVERS. INCLUDE LABOR AND TRAVEL. | TRION TECHNOLOGY INC | $6,077 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 334413Semiconductor and Related Device Manufacturing | 7030 | Aug 25, 2016 | Aug 25, 2016 | Feb 15, 2017 | ||
| ANNUAL MAINTENANCE FOR A SIRUS T2 REACTIVE ION ETCHER | TRION TECHNOLOGY INC | $36,666 | DEPT OF THE NAVY | DEPT OF THE NAVY | — | 334516Analytical Laboratory Instrument Manufacturing | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Sep 18, 2014 | Sep 18, 2014 | Sep 17, 2017 | ||
| MAINTENANCE AGREEMENT FOR A TRION TECHNOLOGY PLASMA ICP ETCHING SYSTEM, WITH AN OPTION FOR AN ADDITIONAL YEAR OF COVERAGE. | TRION TECHNOLOGY INC | $60,462 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 811219 | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Aug 29, 2014 | Aug 29, 2014 | Aug 31, 2016 | ||
| IGF::OT::IGF PLASMA ETCHER ONSITE REFURBISHMENT | TRION TECHNOLOGY INC | $108,719 | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | DEFENSE MICROELECTRONICS ACTIVITY (DMEA) | — | 811219 | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Apr 14, 2014 | Apr 10, 2014 | Aug 21, 2016 | ||
| PROCUREMENT OF ANNUAL MAINTENANCE CONTRACT FOR LABORATORY PLASMA ETCHER SYSTEM, LOCATED IN BLDG 7804 - REDSTONE ARSENAL. | TRION TECHNOLOGY INC | $0 | DEFENSE CONTRACT MANAGEMENT AGENCY (DCMA) | DEPT OF THE ARMY | — | 334516Analytical Laboratory Instrument Manufacturing | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Aug 26, 2013 | Aug 26, 2013 | Aug 31, 2014 | ||
| IGF::OT::IGF FUNDS FOR MAINTENANCE SERVICE FOR A TRION ETCHER; INCLUDING PARTS AND LABOR FOR 12 MONTHS. | TRION TECHNOLOGY INC | $111,760 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 334413Semiconductor and Related Device Manufacturing | J066MAINT/REPAIR/REBUILD OF EQUIPMENT- INSTRUMENTS AND LABORATORY EQUIPMENT | Jul 25, 2013 | Jul 25, 2013 | Jul 4, 2018 | ||
| INDUCTIVELY COUPLED PLASMA REACTIVE ION | TRION TECHNOLOGY INC | $323,850 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 334413Semiconductor and Related Device Manufacturing | 6640LABORATORY EQUIPMENT AND SUPPLIES | Jan 15, 2013 | Jan 18, 2013 | Feb 15, 2014 | ||
| PECVD SYSTEM | TRION TECHNOLOGY INC | $315,875 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 333295 | 6640LABORATORY EQUIPMENT AND SUPPLIES | Sep 20, 2012 | Sep 20, 2012 | Mar 29, 2013 | ||
| IGF::OT::IGF OTHER FUNCTIONS. MAINTENANCE AGREEMENT FOR TRION CHLORINE REACTIVE ION ETCHER (RIE). SYSTEM REQUIRES PREVENTIVE MAINTENANCE, REPAIR, AND PERIODIC UPGRADES BY A QUALIFIED ENGINEER ON A REGULAR BASIS. | TRION TECHNOLOGY INC | $22,352 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 333295 | J099 | Jul 6, 2012 | Jul 5, 2012 | Jul 4, 2013 | ||
| OPTION FOR TRION PHANTOM | TRION TECHNOLOGY INC | $108,000 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 333295 | 6625ELECTRICAL AND ELECTRONIC PROPERTIES MEASURING AND TESTING INSTRUMENTS | Nov 29, 2011 | Nov 29, 2011 | Feb 21, 2012 | ||
| TRION PHANTOM III REACTIVE ION ETCH SYSTEM WITH PFEIFFER TURBO PUMP | TRION TECHNOLOGY INC | $151,750 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 333295 | 6640LABORATORY EQUIPMENT AND SUPPLIES | Sep 7, 2011 | Sep 6, 2011 | Nov 29, 2011 | ||
| SERVICE MAINTENANCE CONTRACT FOR TRION ETCHER SYSTEM | TRION TECHNOLOGY INC | $22,352 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 333295 | J099 | Jul 19, 2011 | Feb 18, 2011 | Feb 17, 2012 | ||
| PLASMA ETCHER SYSTEM (PHANTOM III RIE ETCH SYSTEM) | TRION TECHNOLOGY INC | $338,900 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 332721Precision Turned Product Manufacturing | 6640LABORATORY EQUIPMENT AND SUPPLIES | Feb 25, 2011 | Feb 25, 2011 | Jun 14, 2011 | ||
| NASA GODDARD SPACE FLIGHT CENTER'S (GSFC) DETECTOR DEVELOPMENT LABORATORY (DDL) PRODUCES MULTILAYER CIRCUITS ON FOUR INCH AND SIX INCH SILICON WAFERS FOR TECHNOLOGY DEMONSTRATIONS AND FLIGHT HARDWARE OF DETECTOR FOCAL PLANES AND OTHER COMPONENTS. AN ESSENTIAL TOOL REQUIRED TO BUILD THESE CIRCUITS IS A REACTIVE ION ETCHER (RIE) THAT CAN CHEMICALLY ETCH THIN METAL AND DIELECTRIC FILMS ON PLANAR SUBSTRATES. THE DDL AT GSFC POSSESSES SEVERAL SUCH TOOLS AND HAS DEDICATED THEM TO SPECIFIC PROCESSES TO MAINTAIN INTEGRITY OF THE SPECIFIC PROCESS AND TO PREVENT CROSS-CONTAMINATION OF SUBSTRATES DUE TO PROCESSES THAT ARE INCOMPATIBLE. THESE INCLUDE TOOLS DEDICATED TO INDIUM, GAAS, AND DIELECTRIC MEMBRANES. OTHER PROCESSES HAVE BEEN PERFORMED IN A SINGLE, COMMON-USE, NON-LOAD-LOCKED RIE REGARDLESS OF PROCESS COMPATIBILITY OR CAPABILITY OF THE TOOL. BECAUSE NASA PROJECTS ARE MOVING FROM PROTOTYPING TO PRODUCTION OF CERTAIN DETECTOR FOCAL PLANES, THE DDL NOW REQUIRES A LOAD-LOCKED R1E TO DEDICATE TO ETCHING OF SPECIFIC METALS. RECENTLY, THE DDL HAS BEGUN TO REQUIRE HIGHLY REPRODUCIBLE ETCHES FOR SUPERCONDUCTING MICROSTRIPLINE CIRCUITS WHICH INCLUDE ETCHES OF NIOBIUM AND MOLYBDENUM AS WELL AS VAPOR DEPOSITED SILICON OXIDE. THESE ETCHES REQUIRE CAREFUL CONTROL OF SIDEWALL PROFILES, GOOD SELECTIVITY OF THE TARGET MATERIAL TO HOTORESIST, HIGHLY UNIFORM ETCH RATES ACROSS THE FULL AREA OF THE SUBSTRATE, AND SENSITIVE END POINT DETECTION. FURTHER, TO MAINTAIN THE REPRODUCIBILITY OF THE RECIPES IN THE RIE, THE VACUUM CHAMBER WHERE THE ETCHING TAKES PLACE MUST HAVE HIGHLY REPRODUCIBLE VACUUM CONDITIONS (LOW WATER CONTENT, LOW BASE PRESSURE). A VACUUM-PUMPED LOAD LOCK WILL ALSO BE SPECIFIED TO ACHIEVE THE REQUIRED CHAMBER CONDITIONS. THE RIE TOOL WILL NEED TO SUPPORT ONLY FLUORINE CHEMISTRY AND HAVE FULLY SEALED SYSTEM SUITABLE FOR HANDLING OF CORROSIVE GASES AND RIE BIPRODUCTS. THE OBJECTIVE OF THIS PROJECT IS TO PROCURE A LOAD-LOCKED REACTIVE ION ETCHER SUITABLE FOR ETCHING THIN FILMS OF NIOBIUM AND MOLYBDENUM ON FOUR INCH AND SIX INCH SUBSTRATES TO BE INSTALLED IN THE NASA GSFC DDL. NO PROTOTYPES, OR ONE-OF-A-KIND SYSTEMS WILL BE CONSIDERED. THE UNIT MUST BE A PRODUCTION MODEL WITH AT LEAST 5 SIMILAR UNITS WORKING IN THE FIELD. THE SYSTEM MUST HAVE A VACUUM LOADLOCK FOR LOADING/UNLOADING WAFERS INTO THE PROCESS CHAMBER WITHOUT THE INTRODUCTION OF ATMOSPHERE. THE LOADLOCK MUST HE EQUIPPED WITH A LOAD ARM FOR TRANSFER OF WAFERS BETWEEN THE LOADLOCK AND PROCESS CHAMBERS WHILE UNDER VACUUM. THE EQUIPMENT MUST HAVE A SMALL FOOTPRINT, UTILIZING NO MORE THAN 4 FEET BY 5 FEET OF FLOOR SPACE FOR THE MAIN SYSTEM AND COMPUTER CONTROLLER. (WATER CHILLER NOT INCLUDED IN THIS FOOTPRINT.) THE SYSTEM MUST BE CLASS 10 CLEANROOM COMPATIBLE. ALL OBJECTS WITHIN THE PROCESS CHAMBER THAT ARE EXPOSED TO THE PROCESS PLASMA MUST BE CHEMICALLY RESISTANT TO FLUORINE AND OXYGEN ETCHING PLASMAS. ALL GAS LINES MUST BE HIGH PURITY STAINLESS STEEL WITH WELDED VCR FITTINGS. THE SCOPE OF THIS WORK INCLUDES PRODUCTION AND DELIVERY OF A LOAD-LOCKED REACTIVE ION ETCHER TO THE GSFC DDL. THIS INCLUDES THE FOLLOWING: A) DESIGN OF THE RIE SYSTEM AT THE VENDOR LOCATION, B) APPROVAL OF THE DESIGN BY THE GSFC TECHNICAL REPRESENTATIVE. COMMUNICATING REQUIREMENTS TO GSFC FOR INSTALLATION INCLUDING ELECTRICAL POWER NEEDS, GASES AND WATER. C) CONSTRUCTION OF THE RIE AT THE VENDOR FACILITY, D) TESTING OF THE RIE AT THE VENDOR FACILITY INCLUDING ETCHING TEST PARTS PROVIDED BY GSFC TECHNICAL REPRESENTATIVE E) SHIPPING THE UNIT TO GSFC WHERE GSFC PERSONNEL WILL INSTALL IT IN THE DDL F) DEMONSTRATION OF THE RIE AND TRAINING OF GSFC PERSONNEL BY VENDOR | TRION TECHNOLOGY INC | $232,655 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 333295 | 5962MICROCIRCUITS, ELECTRONIC | Feb 10, 2011 | Feb 14, 2011 | May 14, 2012 | ||
| REACTIVE-ION ETCHING SYSTEM (R.I.E.) | TRION TECHNOLOGY INC | $149,900 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 333295 | 3695MISCELLANEOUS SPECIAL INDUSTRY MACHINERY | Feb 3, 2011 | Feb 3, 2011 | Jul 29, 2011 | ||
| TABLE TOP REACTIVE ION ETCHER (RIE) | TRION TECHNOLOGY INC | $0 | DEPT OF THE NAVY | DEPT OF THE NAVY | — | 333295 | 5961SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE | Jul 16, 2010 | Jul 14, 2010 | Oct 6, 2010 | ||
| INDUCTIVELY COUPLED PLASMA CHLORINE ETCH SYSTEM | TRION TECHNOLOGY INC | $0 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | — | 333295 | 6640LABORATORY EQUIPMENT AND SUPPLIES | Jun 10, 2009 | Jun 10, 2009 | Sep 4, 2009 |