HPCMP Technical Insertion BOA On Ramp Opportunity

The U.S. Army Engineering Research and Development Center (ERDC) issued this combined synopsis/solicitation to on-ramp interested firms onto an existing suite of Basic Ordering Agreements (BOAs) for supercomputer Technology Insertions. These agreements support the High Performance Computing Modernization Program (HPCMP) by evaluating industry capabilities to provide sustainable high-performance computing (HPC) for the Department of Defense research, development, test, and evaluation community. This requirement assists the HPCMP mission of accelerating the transition of defense technologies into warfighting capabilities through the acquisition of balanced systems for five DOD Supercomputing Resource Centers.

The procurement is classified under NAICS 334111 Electronic Computer Manufacturing and PSC 7B20 IT AND TELECOM - HIGH PERFORMANCE COMPUTE (HARDWARE AND PERPETUAL LICENSE SOFTWARE). The government seeks commercially-available, production-grade HPC systems featuring integrated processor, memory, disk I/O, interconnect, and operating system capabilities suitable for complex, large-scale scientific calculations. The existing BOA suite, established in October 2021, has a total capacity of $369.75 million and a five-year life cycle ending in October 2026.

Solicitation W912DY20R0066 is open to any size business concern, and capability statements are due by November 3, 2023. Performance will take place in the United States under the management of the ERDC-WES office. Supporting documentation includes one PDF attachment titled B08.03 Combined Synopsis_Solicitation-FY24-BOA-On-Ramping - 03OCT2023.pdf, which was posted with the notice on October 3, 2023. Melissa Lynn serves as the point of contact for this federal opportunity.