Average obligated amount per year since period start.
Portion of total contract value already obligated.
Share of total value represented by subawards.
DESING OF THE DMS268-5 0.1 UM PHEMT MMIC HIGH POWER AMPLIFIER WAFER CHIPS. 1. INCREASE THE SIZE OF RF OUT BOND PADS TO 3X3MIL 2. FLATTEN POWER RESPONSE OVER 25.5 - 27 GHZ 3. DECREASE POWER DISSIPATION AND INCREASE GAIN OF DRIVER STAGE 4. INCREASE OUTPUT POWER CAPABILITY BY >=0.5DB WILL BE PROVIDING A DESIGN PACKAGE THAT INCLUDES SIMULATED PERFORMANCE OF THE REDESIGNED MMIC AND SPECIFICALLY SHOWS HOW THE REDESIGN PERFORMS AGAINST THE FOUR DESIGN GOALS ABOVE.
Task order obligations
Estimated months remaining until end of performance.
Period of performance
100% of period elapsed
Awarding Agency
NANATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Code: 8000
Funding Agency
Funding Agency
Code: —
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