THE APPLIED ENGINEERING AND TECHNOLOGY DIRECTORATE (AETD), ELECTRICAL ENGINEERING DIVISION (EED), CODE 564, EXTREME ENVIRONMENT ELECTRONICS, EFFORT REQUIRES MICROCHIP TEST STRUCTURES FABRICATED IN THE PE FOUNDRY RADIATION HARDENETED 0.5U FC PROCESS. THE REQUIRED MICROCHIPS FROM THIS SPECIFIC FOUNDRY IS BECAUSE (1) THE PROVEN COMPATIBILITY WITH STRINGENT SPACE REQUIREMENTS FOR RADIATION TOLERANCE AND TEMPERATURE, (2) THE PROCESS DESIGN KIT IS CURRENTLY IN HAND AND CAN BE USED FREE OF ADDITIONAL UNPLANNED COST, AND (3) PROJECTED MILESTONES WHICH REQUIRE THAT THE TEST STRUCTURES ARE FABRICATED IN THE PE PROCESS IN ORDER TO CONFIRM TEST RESULTS ACQUIRED DURING EARLIER TESTING AND DEVELOP A LOW TEMPERATURE MODEL FOR THIS SPECIFIC PROCESS. PEREGRINE WILL FABRICATE MASKS AND WAFERS ON PEREGRINE'S ULTRACMOS 0.5UM FC PROCESS. THE MICROCHIPS SHALL BE FABRICATED, 3MM X 3MM WITH A UNIQUE SOS 0.5U FC FABRICATION PROCESS THAT IS RADIATION HARDENED, WHICH YIELDS "IMMUNITY BY PROCESS" AS OPPOSED TO "IMMUNITY BY DESIGN". THERE SHALL ALSO BE PROVIDED, FIFTY (50) UNPROBED DICE OF THE SUBMITTED CHIP DESIGN. THE PE HAS A FABRICATION PROCESS THAT HAS COLD TEMPERATURE IMMUNITY. THE PE PROCESS RADIATION IMMUNITY AND PROVEN COLD TEMPERATURE OPERABILITY ARE ESSENTIAL CHARACTERISTICS FOR MICROCHIPS TO BE USED IN SPACE APPLICATIONS.