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Award ID | Description | Recipient | Total Value | Awarding Agency | Funding Agency | Set Aside | NAICS | PSC | Award Date | Start Date | End Date | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BASE EFFORT - SBIR PHASE I | EOTRON LLC | $164,735 | DEPT OF THE ARMY | DEPT OF THE ARMY | — | 541715Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) | AC23NATIONAL DEFENSE R&D SERVICES; ATOMIC ENERGY DEFENSE ACTIVITIES; EXPERIMENTAL DEVELOPMENT | Sep 23, 2020 | Sep 28, 2020 | Jul 28, 2021 | ||
| IGF::OT::IGF EOTRON HAS INTRODUCED AN IMPROVED ILLUMINATION SOURCE FOR 3D IR LASER TIME-OF-FLIGHT (TOF) SYSTEMS BASED ON ITS PATENTED 3D SILICON TECHNOLOGY ORIGINALLY DEVELOPED TO IMPROVE EFFICIENCY AND POWER OF SOLID STATE LASERS. USING PROPRIETARY DESIGN, FABRICATION AND THERMAL MANAGEMENT TECHNIQUES, EOTRON DEVELOPED A HIGHLY EFFICIENT AND COMPACT SILICON PACKAGE / ASSEMBLY FOR BOTH IR VCSEL AND LASER DIODE ILLUMINATION SOURCES THAT CAN BE MODULATED IN HIGH PEAK POWER&HIGH FREQUENCY TO INCREASE THE RANGE AND RESOLUTION OF A 3D IR LIDAR SYSTEM. EOTRON'S 3D LIDAR SYSTEM OVERCOMES THE LIMITING FACTORS FOUND IN COMPLEX LASER BASED SYSTEMS WHILE OPERATING AT LESS POWER CONSUMPTION DUE TO IMPROVED THERMAL MANAGEMENT AND A MORE EFFICIENT FREQUENCY DRIVING METHOD. IN ADDITION TO THESE ADVANTAGES, THE 3D LIDAR SYSTEM CAN REDUCE SYSTEM SIZE AND WEIGHT BY OVER 50%, WHILE ALSO LOWERING COST OF MANUFACTURING. OUR SYSTEM IS IDEAL FOR APPLICATIONS REQUIRING 3D LONG RANGE, HIGH RESOLUTION REAL TIME IMAGING IN A LIGHT-WEIGHT AND COMPACT PACKAGE. | EOTRON LLC | $754,698 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 541712 | AR11SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH | May 12, 2017 | May 12, 2017 | Dec 20, 2019 | ||
| IGF::OT::IGF EOTRON HAS INTRODUCED A HIGH PERFORMANCE 3D TIME-OF-FLIGHT LASER ILLUMINATION SOURCE BASED ON ITS PATENTED SILICON PACKAGING TECHNOLOGY ORIGINALLY DEVELOPED TO IMPROVE POWER AND BRIGHTNESS IN HIGH-POWER DIODE LASER MODULES. USING PROPRIETARY DESIGN, FABRICATION AND THERMAL MANAGEMENT TECHNIQUES, EOTRON HAS DEVELOPED A COMPACT LASER ILLUMINATION SOURCE THAT ACHIEVES A HIGH PULSE MODULATION RATE AND PEAK POWER OUTPUT WITH FAST RISE TIMES. THIS TECHNOLOGY ALLOWS FOR REAL TIME 3D IMAGING AND RANGING USING HIGHER PEAK POWER AND PULSE RATE TO PROVIDE BOTH LONG DISTANCE AND HIGH RESOLUTION IMAGING. EOTRONS 3D TIME-OF-FLIGHT (TOF) TECHNOLOGY WILL ADD NEW DIMENSIONS AND CAPABILITIES TO A SEEMINGLY ENDLESS NUMBER OF APPLICATIONS. WHETHER IT IS FOR COLLISION AVOIDANCE SYSTEMS FOR MANNED OR UNMANNED AIR OR GROUND VEHICLES, SURVEILLANCE SYSTEM'S INTRUDER DETECTION OR IDENTIFICATION, ROBOTIC VISION OR ARTIFICIAL INTELLIGENCE, ALL CAN BENEFIT FROM THIS TECHNOLOGY. ADD TO THIS THAT THE TECHNOLOGY IS WAFER SCALE PRODUCTION READY, LOWERING THE COST OF PRODUCTION IN VOLUME. | EOTRON LLC | $124,961 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 541712 | AR11SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH | May 12, 2016 | Jun 10, 2016 | Dec 9, 2016 | ||
| IGF::OT::IGF THE DEVELOPMENT OF ADVANCED SMALL SPACECRAFT WITH INCREASED CAPABILITY AND PERFORMANCE REQUIRES NEW TECHNOLOGIES AND APPROACHES TO THERMAL MANAGEMENT. NEWER AND MORE COMPLEX INTEGRATED ELECTRONICS ADD TO MISSION CAPABILITY BUT ALSO PRODUCE MORE WASTE HEAT. TRADITIONAL METHODS OF METAL HEAT PIPES OR STRUCTURES HAVE ISSUES WHEN SCALING TO ACCOMMODATE HIGHER THERMAL LOADS, ESPECIALLY IN THE VACUUM AND EXTREME CONDITIONS OF SPACE. EOTRON HAS DEVELOPED A 3D SILICON FRONT END TO A FLUID PUMP LOOP COOLING SYSTEM THAT OFFERS IMPROVED PERFORMANCE IN A COMPACT LIGHT-WEIGHT FORM FACTOR. THE PROPOSED SILICON COLD PLATE MAKES DIRECT CONTACT WITH HIGH THERMAL FLUX DEVICES AND REMOVES WASTE HEAT THROUGH A SERIES OF FLUID CHANNELS INTERNAL TO THE SILICON. THE SILICON PLATE IS BONDED TO THE SYSTEM PCB AT THERMAL VIA POINTS TO REMOVE ADDITIONAL HEAT AND PROVIDE ELECTRICAL AND SYSTEM CONNECTION TO OTHER ELECTRONIC COMPONENTS. FLUID, MOVING THROUGH SILICON'S INTERNAL CHANNELS IS THEN MOVED TO ANOTHER AREA FOR THERMAL RADIATION BY A SYSTEM PUMP. IN THIS PROPOSAL, THE COMPANY OUTLINES ITS PLANS TO DESIGN, FABRICATE AND TEST A PROTOTYPE TO PROVE ITS CAPABILITY TO REMOVE A TYPICAL HIGH THERMAL LOAD FROM A COMPACT SYSTEM ALONG WITH BASIC RELIABILITY TESTING ON THE FLUID SYSTEM. SILICON'S ADVANTAGES OF LIGHT-WEIGHT, HIGH THERMAL CONDUCTIVITY AND NONREACTIVE NATURE TO LIQUIDS MAKE IT IDEAL FOR THIS APPLICATION. | EOTRON LLC | $124,943 | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | — | 541712 | AR11SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH | Jun 9, 2015 | Jun 17, 2015 | Dec 17, 2015 | ||
| IGF::OT::IGF SBIR PHASE II RESEARCH&DEV | EOTRON LLC | $974,848 | MISSILE DEFENSE AGENCY (MDA) | MISSILE DEFENSE AGENCY (MDA) | — | 541712 | AC22NATIONAL DEFENSE R&D SERVICES; ATOMIC ENERGY DEFENSE ACTIVITIES; APPLIED RESEARCH | May 29, 2014 | May 29, 2014 | Dec 1, 2016 | ||
| PH I RESEARCH&DEVELOPMENT - DEVELOPMENT OF LINE-NARROWED DIODE PUMP SOURCES FOR DPAL SYSTEMS IGF::OT::IGF | EOTRON LLC | $149,892 | DEFENSE CONTRACT MANAGEMENT AGENCY (DCMA) | MISSILE DEFENSE AGENCY (MDA) | — | 541712 | AC21NATIONAL DEFENSE R&D SERVICES; ATOMIC ENERGY DEFENSE ACTIVITIES; BASIC RESEARCH | Jan 8, 2013 | Jan 8, 2013 | Apr 24, 2014 | ||
| NEW AWARD. | EOTRON LLC | $1,344,348 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 541712 | AC55 | Jan 26, 2012 | Jan 26, 2012 | Apr 7, 2016 | ||
| EFFICIENT HIGH POWER PUMPING PLATFORM FOR SOLID STATE MATERI | EOTRON LLC | $99,822 | DEPT OF THE AIR FORCE | DEPT OF THE AIR FORCE | — | 541712 | AC25NATIONAL DEFENSE R&D SVCS; ATOMIC ENERGY DEFENSE ACTIVITIES; R&D FACILITIES & MAJ EQUIP | Jan 12, 2011 | Jan 13, 2011 | Jan 12, 2012 |