HPCMP Technical Insertion BOA On Ramp Opportunity

The U.S. Army Engineering Research and Development Center (ERDC) issued solicitation W912DY20R0066 to identify firms capable of joining an existing suite of Basic Ordering Agreements (BOAs) for supercomputer Technology Insertions. This "on-ramp" opportunity supports the High Performance Computing Modernization Program (HPCMP) in providing sustainable, production-grade high-performance computing systems for the Department of Defense research, development, test, and evaluation community. The existing BOA suite, established in October 2021 with a total capacity of $369.75 million, has a five-year lifecycle ending in October 2026.

This requirement focuses on the delivery of commercially available systems that integrate processors, memory, disk I/O, interconnects, and operating systems to perform complex, large-scale scientific calculations across five DoD Supercomputing Resource Centers. The opportunity is classified under NAICS 334111 Electronic Computer Manufacturing and PSC 7B20 IT and Telecom - High Performance Compute (Hardware and Perpetual License Software). There is no specific set-aside for this notice, and the government is inviting capability statements from business concerns of any size.

The ERDC-WES office serves as the primary contracting point for this requirement, with performance occurring within the United States. Responses are due by November 3, 2023, following the initial publication on October 3, 2023. Additional details regarding the on-ramping process are contained in a single attachment titled "B08.03 Combined Synopsis_Solicitation-FY24-BOA-On-Ramping - 03OCT2023.pdf" posted with the solicitation.